Welcome to the 2016 27th Annual SEMI® Advanced Semiconductor Manufacturing Conference!

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With the advent of pervasive microelectronics, we now increasingly live in another kind of complex ecosystem, one in which we depend on the microSiome (the transistors and sensors and miniature radios, among other components, we wear, carry in our pockets, or that are embedded in our cars, homes, and offices) to enrich and extend our lives, improve our productivity, and bond with friends and family, be they near or far.  As microelectronics content expands into more and more of our daily lives, regular discussions among industry professionals about continued advancements in commercial semiconductor manufacturing have become more and more essential.  These discussions are the essence of ASMC 2016. 

This year’s conference offers a host of stimulating presentations, from keynotes to technical sessions and tutorials, addressing a wide variety of cutting-edge topics in microelectronic device fabrication.  Beginning with a welcoming reception, and extending over the next three days, the ASMC 2016 program is filled with opportunities for networking with industry peers, and for learning and sharing knowledge on new, and best-method, semiconductor manufacturing practices and concepts vital to continued progress in the field.

We hope you will enjoy our 27th annual conference in Saratoga Springs, New York.  Sincere thanks to our technical committee, session chairs, speakers, volunteers and sponsors for their support of this conference. Their contributions are invaluable and we are truly grateful for their efforts and support.  Special thanks to Dr. Janay Camp/KLA-Tencor and Dr. Jeanne Bickford/GLOBALFOUNDRIES for their leadership as this year’s conference co-chairs.  We also acknowledge the tireless work of ASMC technical committee members. 

A Note to Attendees:

You must check-in at the ASMC registration desk to pick up your registration packet, including name badge, conference information, and reception ticket(s).   ASMC 2016 presentations (for which we have permission) will be shared immediately following the conference.

ASMC 2016 Proceedings

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